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Wafer Lapping
FO PDF Print E-mail

In producing these semiconductor devices, the surface of the semiconductor wafer, most typically silicon, or a compound semiconductor, must be precisely lapped. The most suitable material to process the surface of semiconductor elements is the product harvested from Fujimi's technology: the precision lapping powder FO.

FO is an alumina-based precision lapping powder, made using carefully selected materials, and undergoing Fujimi's own unique processing to produce a powder with special particle shape and hardness. Produced under the strictest quality control, FO provides constant, stable lapping capability, with no scratching on the surface of the material being lapped. This being the case, not only is FO effective with semiconductor wafers, but it also possesses superior capabilities in the processing of lenses, prisms, and other glassware used for optical applications. Thus, FO can be used with complete confidence, for high value-added workpieces.

 


 

 

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A, WA & PWA PDF Print E-mail

A

A is the most widely known abrasive powder, popularly called alundum. This product is made by melting bauxite in an electric furnace at a temperature of 2000℃ to obtain aluminumoxide (Al2O3) corundum crystal of at least 90% purity. One special feature of this product is that the toughness (tenacity) of the abrasive particles has been increased by fusing them with a small percentage of titanium. As a result, A has the highest degree of toughness among all Fujimi abrasive powders.

This product, which is manufactured to sustain a consistent distribution of particle sizes, is a highly efficient abrasive and will not scratch the surface of the workpiece, and maintains great stability as it functions as an abrasive. A is well suited for use as a material in super-finishing precision grindstones and super-finishing lapping cloth or paper. It is the most suitable abrasive powder for use on cathode-ray tubes and related glassware, and soft metals, where precision lapping is required.


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