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Product Choice PDF Print E-mail
Product Choice


Fujimi produces a selection of abrasives powders and polishing slurries suitable for use in many production areas, to aid selection of the correct materials for your process we have produced two product selection matrix, these can be downloaded for review.  Please contact us if you require any further product or process advice and for questions about availability, price and ordering.

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Glanzox PDF Print E-mail
Polishing

With the increasing integration of semiconductor devices and the larger size of wafers, a silicon surface that is free of damage, haze and heavy metal contamination, as well as flat, and nanotopographically mirror-like is essential. 

Fujimi's GLANZOX series was developed to meet such requirements. GLANZOX polish consists of colloidal silica dispersed in a liquid composed of special ingredients. This product results in an almost perfectly polished surface. In response to the recent demand for considerable reductions in the metal impurities that affect device characteristics, higher grades of polish containing ultrapure colloidal silica have been developed.

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Surfin Polishing Pads PDF Print E-mail
Polishing

SURFIN polishing pads are used for precision polishing of silicon wafers and semiconductor crystals, metals and glasses. Building on its expertise and research in abrasive materials and knowledge of raw materials as well as technology to control particles, Fujimi has expanded its capabilities to offer such products as insulation coatings for electron guns and catalyst carriers for pollution control.


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Insec PDF Print E-mail
Polishing

The INSEC series is a range of polishing agents for high-precision mirror-finishing of a compound semiconductor crystal through the mechanochemical process.


This series has a wide variety of products, including: FP (first-stage polishing agent); NIB (final polishing agent) for gallium arsenide (GaAs) wafers; P (final polishing agent) for gallium phosphide (GaP) wafers; SP, an agent used exclusively for double-sided polishing of GaAs wafers, and IPP, which is an agent used for first polishing of indium phosphide (InP) wafers.


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FZ PDF Print E-mail
Polishing

FZ-05 and FZ-02 are composed of ultra-fine zirconium oxide particles. and aloe optimum for polishing special metals such as molybdenum. tangsten. chromium. titanium and nickel. and their alloys. When FZ is used with a hard urethane pad and polishing pitch. it provides the deep. scratch free luster unique to metals. FZ-02 can also be used for final polishing of optical lenses for scrtach free. bump free lens. and clear interference image free of waves.


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FO PDF Print E-mail
Abrasives

In producing these semiconductor devices, the surface of the semiconductor wafer, most typically silicon, or a compound semiconductor, must be precisely lapped. The most suitable material to process the surface of semiconductor elements is the product harvested from Fujimi's technology: the precision lapping powder FO.

FO is an alumina-based precision lapping powder, made using carefully selected materials, and undergoing Fujimi's own unique processing to produce a powder with special particle shape and hardness. Produced under the strictest quality control, FO provides constant, stable lapping capability, with no scratching on the surface of the material being lapped. This being the case, not only is FO effective with semiconductor wafers, but it also possesses superior capabilities in the processing of lenses, prisms, and other glassware used for optical applications. Thus, FO can be used with complete confidence, for high value-added workpieces.

 


 

 

Download the datasheet (881kb)

 

 
GC & C PDF Print E-mail
Abrasives

GC

GC, green silicon carbide, is a very high purity SiC lapping powder. The hexagonal α-type crystal is just below diamond in terms of hardness, and its chemical stability is excellent at room temperature. The result is a product with superior lapping and polishing capabilities, which is not affected by chemicals, and can spontaneously generate sharp grinding edges through fragmentation.

GC is well suited for use as a lapping powder in a wide range of functions, including the precision lapping and dicing of crystal and ferrite, the slicing of Si ingots, and the processing of materials ranging from ultra- hard metals and edged tools to soft metals such as brass and other copper alloys. Additionally, GC is used in the processing of various resins. GC is also ideal for use in super-finishing precision grindstones. As it possesses the electricalproperties of a semiconductor, GC has good heat conductivity and has the ability to withstand high temperatures, making it useful as a material in fine ceramics.


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Thermal Spray Introduction PDF Print E-mail
Thermal Spray Coatings

In response to a strong need in the thermal spraying industry, Fujimi's highly sophisticated powder technology makes possible the introduction of SURPREX, cermet* composite powders. Fujimi's high-quality cermet products have eliminated problems inherent in conventional cermet powders, such as spitting and low deposition efficiency. In addition to cermet products, Fujimi offers a variety of ceramic powders as well as powders for plasma transfer arc (PTA) application.
* Cermet (ceramic and metal): a generic term for composite materials that consist of ceramics and metals.

 


Fujimi is active in the development of new materials for emerging spray coating processes such as warm spray coating, HVAF and cold spray coating, for details of newly developed materials contact us.

 

As an introduction to Fujimi Incorporated thermal spray coating materials and the processes involved please watch the video below.

 

   

 

Download the General Products Brochure (690kb)

Examples of new thermal spray technology developed by FUJIMI

•Development of new HVOF system for spraying fine powders.

•Development of WC cermet coatings with high impact resistance.

•Formation of solid lubricant MoS2/Cu coatings produced by HVOF

•Formation of ceramic coatings by HVOF (theta-gun)

•Development of pure Al2O3 and Y2O3 powders for plasma spraying

•Development of WC cermet coatings with high cavitation erosion resistance

•Elucidation of the relationship between substrate property and bonding strength of cermet coatings produced by HVOF

•Breakthrough of spitting mechanism on spraying cermet powders by HVOF

•Development of MoB cermet coatings with high corrosion resistance to molten Al alloys or molten Zn alloys

•Drastic improvement of abrasive wear resistance of WC cermet coatings by optimum WC particle size


 

 
Low Temperature Coating PDF Print E-mail
Thermal Spray Coatings

Details of Fujimi Low Temperature Spray Powders can be downloaded below.

Download Fujimi Cold Spray Powder Introduction (641kb)


 
Compol PDF Print E-mail
Polishing

COMPOL is a colloidal silica slurry developed especially for polishing metals, ceramics and electronic substrates such as LiTa03, LiNb03 and sapphire. With excellent particle uniformity and dispersal, it delivers high-removal rate, damage free polishing. COMPOL-50AD and COMPOL-50S combine colloidal silica slurry with special organic amines, specifically designed for high-removal rate primary and secondary polishing of silicon wafer. Even when used at high dilutions, COMPOL delivers excellent processing efficiency and long slurry life.


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Polipla PDF Print E-mail
Polishing

Fujimi POLIPLA is a compound-type polishing slurry developed specifically for polishing lenses made from plastics such as CR-39 and Polycarbonate. The high purity alumina is uniformly dispersed in a specially developed solution with a pH in the range of 3.0 to 4.0, the formulation delivers excellent polishing performance and a high quality finished surface.  It is available in a wide range of formulations to meet the requirements of many applications and process flows, please contact us for updated information of the optimal solution for your process needs.

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Clealite PDF Print E-mail
Polishing

CLEALITE is a polishing slurry for all kinds of metals, including aluminum. stainless steel and titanium to produce mirror finish. The 2340 type has special additives that delivers scratch free surface with surface roughness of 10nm (Rmax). The S type is based on colloidal silica slurry balanced with special additives to control selective processing. and has been specifically developed as final polishing slurry for metals. The polishing method and conditions are same for both 2340 type and S type. but S type provides higher removal rate and better surface performance.


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Planerlite PDF Print E-mail
CMP Slurry

The PLANERLITE series of polishing slurries is intended for use in chemical mechanical planarization (CMP), a key planarization process in the fabrication of high-density ultra large scale integration (ULSI) devices. It has been developed under the basic concepts of high purity, high removal rate, high dispersion and scratch-free performance.


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A, WA & PWA PDF Print E-mail
Abrasives

A

A is the most widely known abrasive powder, popularly called alundum. This product is made by melting bauxite in an electric furnace at a temperature of 2000℃ to obtain aluminumoxide (Al2O3) corundum crystal of at least 90% purity. One special feature of this product is that the toughness (tenacity) of the abrasive particles has been increased by fusing them with a small percentage of titanium. As a result, A has the highest degree of toughness among all Fujimi abrasive powders.

This product, which is manufactured to sustain a consistent distribution of particle sizes, is a highly efficient abrasive and will not scratch the surface of the workpiece, and maintains great stability as it functions as an abrasive. A is well suited for use as a material in super-finishing precision grindstones and super-finishing lapping cloth or paper. It is the most suitable abrasive powder for use on cathode-ray tubes and related glassware, and soft metals, where precision lapping is required.


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Fujimi Diamond Pellets PDF Print E-mail
Diamond Products

FDP (Resin)


FDP Resin is a pellet which makes optimum use of the special characteristics of resin and diamonds. It was developed for super precision grinding of optical lenses and prisms. Since a super precision ground surface with an Rmax of O.5.um or less can be obtained by using FDP Resin. it is possible at this stage to observe and control NR. Because of this. superb results in areas such as reduction of processing time and increased yield rate of polished products can be attained.


Download the Data Sheet (193kb)

 
HVOF PDF Print E-mail
Thermal Spray Coatings

Fujimi produce a variety powders for HVOF applications, details of our Suprex range is available for download as a PDF.

Download Fujimi Suprex Brochure (1.8mb)


 


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